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Brand Name : TJIN
Certification : ISO9001
Place of Origin : China
MOQ : 1 set
Delivery Time : 40 days
Packaging Details : Wooden Packing
Application : Semiconductor Manufacturing
Capacity : 500-1000 tons
Clamping Force : Hydraulic
Control System : PLC
Cooling System : Water/Oil
Heating Power : 20-50 kW
Injection Pressure : 200-500 kg/cm2
Injection Rate : 100-500 cm3/s
Injection Speed : 100-300 mm/s
Injection Unit : Single/Dual
Max Daylight : 2000-3000 mm
Mold Opening Stroke : 1000-2000 mm
Product Type : Injection Molding Machine
Screw Diameter : 60-100 mm
Automatic Molding Machine
Performance Parameters
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm, thickness 0.15-1.2mm;
● Applicable molding material size: diameter φ 11-20mm, length/diameter 1.2-2.0 (Max 35mm).
FAQ:
Technical Parameters:
Type | Vertical Injection Molding Machine |
Control System | PLC |
Model | SM-1000 |
Cooling System | Water |
Weight | 5 Tons |
Clamping Force | 1000KN |
Capacity | 100 Tons |
Screw Diameter | 35 Mm |
Max. Mold Height | 400Mm |
Injection Pressure | 200 Mpa |
Auto Transfer Molding | Yes |
Auto Packaging Equipment | Yes |
Product Details:
● Standardized mold structure, easy to change;
● High efficiency cake loading component, aluminum box loading;
● Automatic cassette loading, double cassette stacked loading;
● Supports flexible expansion of up to 4 groups of presses to realize high UPH;
● Equipped with vision system to recognize the feeding direction;
● WIN10 + 15 inch touch screen + touch keyboard;
● Mold closing pressure: 98-1764kN;
● Injection pressure: 4.9-30kN adjustable;
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High Durability Semiconductor Molding Machine Automated ISO9001 Approval Images |